Influence of Anode Plates Surface on Copper Foil Roughness

According to research findings, the surface condition of the Ti anode for copper foil electrodeposition is critical. Herein, we designed two approaches to reveal which factor is significant if someone would like to obtain a glossy and smooth ED copper foil. One approach is physical, that is polish condition of the Ti anode; the other approach is chemical, that is etching condition of the Ti anode. The brightness of the ED copper foil was measured by a tool. The surface morphologies of the Ti anode and the ED copper foils were imaged using a scanning electron spectroscopy (SEM). The surface element on the processed Ti anode was analyzed by EDS. The copper deposition and oxidation (i.e., stripping) was examined using cyclic voltammetry (CV). The results show that chemical approach is more effective than physical approach to obtain a glossy and smooth ED copper foil. The result is interesting because it indicates that the surface oxidation condition is a key factor to form a glossy and smooth ED copper foil rather than surface roughness of the Ti anode.