Titanium Rotating Cylinder Target

It is a component used in physical vapor deposition (PVD) processes, which is a method for depositing thin films of material onto a substrate. The titanium tube target is made of pure titanium and is shaped like a cylinder that rotates during the PVD process.

The PVD process works by using an electric arc or magnetron sputtering to vaporize the target material, in this case, titanium, and deposit it as a thin film onto a substrate. The rotating cylinder target allows for a more uniform deposition of the titanium film onto the substrate.

The benefits of using in PVD processes include high purity of the deposited film, high deposition rate, and improved film adhesion. The titanium rotary targets for magnetron sputtering is made of high-quality titanium material and is designed to withstand high temperatures and mechanical stresses during the PVD process.

Specification Introduction

Normal Size Type:

Our advantage

The titanium targets we supply have small grains, uniform distribution, high purity, few inclusions, and high purity. The deposited TiN film is used in decoration, tooling, semiconductor and other fields, with good adhesion, uniform coating and bright colors.

--Purity

To produce a qualified titanium sputtering target, purity is one of its important performance indicators. The purity of the titanium target has a great influence on the performance of the sputter coating. The higher the purity of the titanium target, the less impurity element particles in the sputtered titanium film, resulting in better PVD coating performance, including better corrosion resistance and electrical and optical properties. However, in practical applications, titanium targets for different purposes have different requirements for purity. The target material is used as the cathode source in sputtering, and the impurity elements and porosity inclusions in the material are the main pollution sources of the deposited film. The porosity inclusions will be basically removed during the non-destructive testing of the ingot, and the porosity inclusions that are not removed will cause discharge during the sputtering process, thereby affecting the quality of the film; the content of impurity elements can only be reflected in the test results of full element analysis , the lower the total impurity content, the higher the purity of the titanium target.

--Density

Density is also an important factor in measuring the quality of titanium targets. In order to reduce the porosity in the target solid and improve the performance of the sputtered film, the target is usually required to have a higher density.

The density of the target affects not only the sputtering rate, but also the electrical and optical properties of the film. The higher the target density, the better the performance of the film. Additionally, increasing the density and strength of the target allows the target to better withstand thermal stress during sputtering. Density is also one of the key performance indicators of the target.

--Particle size and its distribution

Typically, sputtering targets are polycrystalline structures with grain sizes on the order of several micrometers to several millimeters. For the same target, the smaller the particle size of the target, the faster the sputtering speed of the target; in addition, the target with smaller particle size difference can sputter a film with a more uniform thickness. The study found that if the grain size of the titanium target is controlled below 100 μm, and the variation of the grain size is kept within 20%, the quality of the sputtered film can be greatly improved.

--crystallographic orientation

Titanium has a close-packed hexagonal structure. Since the atoms of the titanium target are easily sputtered along the hexagonal close-packed direction of the atoms during sputtering, in order to achieve a higher sputtering rate, the crystal structure of the target can be changed by changing the method. to increase the sputtering rate. The crystallographic direction of the titanium target also has a great influence on the thickness uniformity of the sputtered film.

--Structural uniformity

Structural uniformity is also one of the important indicators to examine the quality of the target. For titanium targets, not only the sputtering plane of the target, but also the normal direction composition, grain orientation and average grain size uniformity of the sputtering plane are required. Only in this way, the titanium target can obtain a titanium film with uniform thickness, reliable quality and consistent grain size at the same time during its service life.

Specification case

Rotation speed: The target should be capable of rotating at speeds up to several thousand RPM to achieve a more uniform deposition rate and extend the target's life.

Cooling: The titanium tube target should be water-cooled to dissipate the heat generated during the deposition process and prevent damage to the target.
Backing plate: A titanium backing plate is typically used to support the rotating cylinder target and provide electrical contact.
Bonding method: The target is usually bonded to the backing plate using diffusion bonding or other high-strength bonding methods to ensure good thermal and electrical conductivity.
Purity: The titanium rotary targets for magnetron sputtering should have a high level of purity to minimize the impurities in the deposited films and ensure consistent performance. The impurity level should be less than 1000 parts per million (ppm) for most applications.

Overall, the specifications of a titanium rotating cylinder target will vary depending on the specific application requirements, and the target can be customized to meet these needs.

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