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![TiAl50:50at% Sputtering Target For Brown Color]()
TiAl50:50at% Sputtering Target For Brown ColorTi50%Al50% sputtering Target, TiAl alloy sputtering target, titanium-aluminum alloy target at:50%
Purity:>99.8% (2N8)
Grain Size:<100um
Process:HIP
Shape:Rectangular target,... -
![Chromium Target]()
Chromium TargetChromium target,Cr target,Chromium sputtering target
Purity:99.5%-99.99%
Rectangular target, Round target,rotary target
Forming process: hot isostatic... -
![Zirconium sputtering target]()
Zirconium sputtering targetZirconium targets,Zirconium planar target,Zr sputtering target
Purity:>99.5%
Dimension:
12x131x1214mm as drawing
12x132x1701mm as drawing
18x164x1810mm as drawing or other... -
![Titanium Rotating Cylinder Target]()
Titanium Rotating Cylinder TargetTitanium Rotary Target for magnetron sputtering
progress:Vacuum Melting,CNC,Extruded
Purity:99.9%，99.95%，99.99%
Shape:rotary,cylinder,tube
Size:OD141*ID125*L1550mm,or as... -
![Multi Arc Chrome Cr Cathode Target]()
Multi Arc Chrome Cr Cathode TargetChromium targets;Chromium Sputtering Targets
Material:Chrome Cr
Purity:Ranging from 99.9%(3N) - 99.99%(4N) Size:Dia100mm×40mm;Dia100mm×45mm;Dia100mm×50mm;Dia80mm×40mm;Dia60mm×30mm or... -
![Titanium round Target For PVD Coating]()
Titanium round Target For PVD CoatingTitanium target,titanium sputtering target,titanium round target,titanium disc Size: Dia100mm×40mm Dia100mm×45mm Dia100mm×50mm Dia80mm×40mm Dia60mm×30mm or...
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![Titanium dioxide TiO2 ceramic sputtering target]()
Titanium dioxide TiO2 ceramic sputtering targetCeramic sputtering target,titanium oxide sputtering target,TiO2 sputtering target
Round:OD25.4mm,OD50mm,OD50.8mm,OD60mm,OD76.2mm,OD80mm,OD101.6mm,OD100mm or as... -
![Titanium Sputtering Target For Decoration And Mould Field]()
Titanium Sputtering Target For Decoration And Mould Fieldtitanium sputtering target,titanium round target,titanium plate target,titanium rotary target Purity:99.7%-99.995%(3N-4N5) Grain size:<100um Application: 1.architectural glass,car using...
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![NiCr 80:20 wt% sputtering targets]()
NiCr 80:20 wt% sputtering targetsNickel Chromium sputtering targets (NiCr 80:20wt%) NiCr(80:20wt%),Ni80Cr20,NiCr8020,NiCr80/20wr%
Purity:99.5%(2N5)
Dimension(mm):Thickness 16(+/-0.1) x Width 170(+/-0.5) x Length... -
![High purity metals multi-arc targets]()
High purity metals multi-arc targetsmetals multi-arc targets,metal and alloy round targets
Material:Titanium target, TiAl alloy target,Mo, Zr, Ta,Nb, NbZr, Ni,Si,Sn, NiGr(8:2)
Purity:2N5 to 4N
Processing... -
![Titanium alloy sputtering Targets]()
Titanium alloy sputtering TargetsTitanium alloy sputtering Targets,titanium round targets,titanium alloy targets
Material:purity titanium >99.4%,TiAl, TiZr, TiNb,TiHf,TiAlSi,TiTa,TiCu targets
Process:smelt,forged,and...
Sputtering Targets are at times created in the faltering plant yet are by and large bought from an external source. This requires specifying important target properties like purity, density, mechanical properties, outgassing rate, geometry, and other factors. Some sputtering targets are the subject of standards being established by ASTM Committee F–1. Manufacturers frequently bond backing plates to targets, and the required bonding should be specified.
The (Zr+Y) metallic cathode target makes up the sputtering target. At mixed gases consisting of (Ar+O2), sputtering deposition takes place. The O2 is the receptive gas component. The density of reactive species on the cathode surface and/or the growing surface of thin films is thought to rise when reactive-gas injection is increased. The deposited thin films contain the reactive gas elements. At the best sputtering deposition conditions, compound oxide thin films of YSZ (ZrO2–Y2O3) are made.
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