High purity metal multi-arc targets are advanced cathode materials used in:

• Multi-arc ion plating

• Magnetron sputtering

• PVD coating systems

• Vacuum deposition equipment

These targets are designed for depositing high-performance thin films with:

• Excellent adhesion

• Uniform coating thickness

• High purity

• Stable arc performance

They are widely used in:

• Semiconductor manufacturing

• Decorative coatings

• Optical coatings

• Tool coatings

• Electronics

• Aerospace

• Solar energy industry

Available Purity

Available Materials

High Purity Metal Targets

• Titanium (Ti)

• Nickel (Ni)

• Copper (Cu)

• Chromium (Cr)

• Aluminum (Al)

• Cobalt (Co)

• Iron (Fe)

• Vanadium (V)

• Tungsten (W)

• Molybdenum (Mo)

• Tantalum (Ta)

• Niobium (Nb)

• Zirconium (Zr)

• Hafnium (Hf)

• Silver (Ag)

• Gold (Au)

• Tin (Sn)

• Zinc (Zn)

• Magnesium (Mg)

• Manganese (Mn)

Available Shapes

• Round target

• Circular target

• Planar target

• Tubular target

• Plate target

• Tube target

Custom geometries can be manufactured according to drawings.

Available Sizes

Round Targets

Plate Targets

Tubular Targets

Manufacturing Technology

Production Processes

• Vacuum melting

• Forging

• HIP (Hot Isostatic Pressing)

• Precision machining

• Grinding

• Surface polishing

Surface Finish

• Ground surface

• Bright polished surface

• Mirror finish

Features

High Purity

Low impurity levels ensure:

• Stable plasma

• High-quality film deposition

• Improved coating consistency

High Density

HIP processing improves:

• Grain uniformity

• Mechanical strength

• Sputtering stability

Excellent Conductivity

Provides:

• Stable arc discharge

• Uniform erosion behavior

• High deposition efficiency

Long Service Life

Optimized material structure offers:

• Low cracking risk

• Stable performance

• Reduced downtime

Working Principle

In multi-arc ion plating systems:

• A high-current low-voltage arc is generated on the target surface

• Localized cathode spots evaporate metal atoms from the target

• The metal vapor becomes ionized plasma

• Ionized particles are accelerated toward the substrate

• Thin functional films are formed on the substrate surface

This process provides:

• High ionization rate

• Strong film adhesion

• Dense coating structure

Applications

Semiconductor Industry

• Integrated circuits

• Thin-film electronics

• Microelectronic devices

Decorative Coatings

• Watches

• Hardware

• Jewelry

• Consumer electronics

Tool Coatings

• Cutting tools

• Mold coatings

• Wear-resistant coatings

Optical Industry

• Reflective coatings

• Anti-reflective coatings

• Transparent conductive films

Solar Industry

• Thin-film photovoltaic coatings

• Functional energy coatings

Optional Related Products

• Alloy sputtering targets

• Rare earth targets

• Backing plates

• Bonded targets

• Metal crucibles

• Evaporation materials

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