Copper Plating Electrode (Ti GR.2 MASH+DSA COATING)
Copper plating electrode (Ti GR.2 MASH+DSA COATING) Specification*** Production quantity: 12 sheets 1.Coating part (both sides) 2.Current density ASD: 2.5~3.5ADS 3. Current efficiency: 80% 4.DC voltage: DC15V 5. Gap distance (distance between plating part and iridium electrode): 60~65mm 6. Electrode operation life: 8 years in use 7. Plating solution components (types) and solution temperature: (water, sulfuric acid, copper sulfate, chlorine, optical fiber) 23°C management
Product Introduction
A copper plating electrode is a key component used in the copper electroplating process. Copper electroplating is a technique in which a thin layer of copper is deposited onto the surface of a metal substrate through an electrochemical reaction.
Copper plating serves several important functions, including:
Providing decorative finishes
Improving corrosion resistance
Increasing electrical and thermal conductivity
Enhancing adhesion for subsequent metal plating layers
In many industrial electroplating processes, copper is used as an undercoat before plating other metals such as nickel, chromium, or gold.
Copper plating electrodes are typically manufactured using Grade 2 titanium substrates coated with DSA (Dimensionally Stable Anode) coatings, which provide excellent catalytic activity, corrosion resistance, and long operational life.
Copper Plating Electrode Specifications
Substrate Material: Titanium Grade 2 (Ti Gr.2)
Coating Type: DSA coating (Iridium-based mixed metal oxide)
Parameter | Specification |
Production Quantity | 12 sheets |
Coating Area | Both sides |
Current Density (ASD) | 2.5 – 3.5 ASD |
Current Efficiency | 80% |
DC Voltage | DC 15V |
Electrode Gap Distance | 60 – 65 mm |
Operating Life | Up to 8 years |
Operating Temperature | 23°C |
Plating Solution Composition
Typical copper electroplating solution includes:
Water
Sulfuric acid
Copper sulfate
Chloride ions
Optical brighteners
These components are maintained at a controlled operating temperature of approximately 23°C to ensure stable plating quality.
Electrode Performance in Different Solutions
Solution Type | Coating Type | Electric Potential | Service Life | Current Density | Size |
Micro-etching solution | Ir-Ta +x | ≤1.4 V | 1–3 years | 200–400 A/m² | Custom |
Acid etching solution | Ir-Ta +x | ≤1.4 V | 1–3 years | 100–300 A/m² | Custom |
Alkaline etching solution | Ru-Ir +x | ≤1.13 V | 1–3 years | 300–500 A/m² | Custom |
Key Advantages
High catalytic efficiency for stable electroplating processes
Excellent corrosion resistance in acidic electrolytes
Long operational life compared with conventional electrodes
Uniform current distribution for consistent copper deposition
Customizable electrode dimensions and configurations
Typical Applications
Copper plating electrodes are widely used in:
PCB manufacturing
Electronics and semiconductor industries
Automotive electroplating
Decorative metal finishing
Industrial electroplating systems
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